Electronics Forum | Sat Mar 11 15:05:54 EST 2006 | Kerm
Hi Craig: I agree with muse. The problems almost always will show up later on duringg life cycles in terms of reliability problems. While the solder joints may look acceptable right after production there is no guarantee of meeting the reliability r
Electronics Forum | Wed Oct 25 12:38:05 EDT 2000 | Phil
Hi there!! You know what your QA is doing is right, coz by measuring the solder paste height can avoid the following defects: 1.Insufficient solder 2.Short solder or bridging 3.Solder balls SPC monitoring for paste height checking is required
Electronics Forum | Mon Sep 10 02:47:27 EDT 2001 | Peter W.
Thank you for your annotaions. I am aware of the limits and temperatures of that material, but we are doing some research with thermoplastic base materials which won't survive standard solder paste reflow soldering. And beside of using conductive ad
Electronics Forum | Thu Nov 06 09:10:13 EST 2003 | successmani
hi, NEMI recommends separate solders for reflow sodlering and wave soldering. Reflow soldering- Sn-3.9Ag-0.7Cu Wave sodlering- Sn-0.7CU Wavesoldering- Sn-0.7Ag What will happen if a mixed technolgy PCb board containing both through hole and surface
Electronics Forum | Thu Jun 16 22:14:51 EDT 2005 | davef
16 thou pitch parts: Use a 5 thou laser cut electropolished stencil with 0.008"x0.045" apertures and type 3 solder paste. Bridges Connecting or Partially Connecting Adjacent Leads or Lands * Excessive solder paste * Excessive component placement pre
Electronics Forum | Wed Jul 25 11:16:34 EDT 2007 | lloyd
Hi Folks, I hope someone can help me, Is the homeplate stencil design (for reduced solder paste) the same for preventing solder balls as it is for reducing tombstones? i.e. the reduction of solder paste under the component termination. I'm trying to
Electronics Forum | Sat Aug 30 12:36:05 EDT 2008 | omid_juve
we are doing many experiment on this problem 1)sn63 pb37 solder paste +normal profile 2)sn62 pb36 ag2 solder paste +normal profile 3)pb free solder paste + pb free profile 4)sn63 pb37 solder paste + pb free profile but still the problem exist so i th
Electronics Forum | Thu May 07 12:54:01 EDT 1998 | DARRYL SCHLOSSER
| I am running a board that is .062" thick and has components that over hang the edge of the board by .090". I have bottom side smt components (chip caps and resistors only) and use the turbulent wave to help solder the components. The problem I am
Electronics Forum | Fri Aug 30 16:25:21 EDT 2002 | davef
Imm silver holds-up to multiple thermal cycles very well. The things, we guess, are happening to make imm silver tough to solder after heating and sitting are: * Oxidation of the silver. * Reduction of the co-deposited organic anti-tarnish [used in
Electronics Forum | Tue Mar 09 07:51:12 EST 2004 | Bryan
Hello everyone: 1.I use Kester R244 63/37 solder paste. 2.Stencil thickness 6 mil. 3.Springdale Chipset. 4.PCB finish:HASL 5.Profile:Peak temp.:210~220C,time above 183C:60~90 seconds,time between 150~183C 60~90 seconds. 6.Reflow oven:Heller 1800 Voi
